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China Does It Again: A NAND Memory Market First | TechInsights
TechInsights has uncovered the world's most advanced 3D NAND memory chip in a consumer device, a surprise achievement from China's YMTC, a top 3D NAND manufacturer. This chip is crucial for high-performance computing, especially in AI and machine learning, and marks a significant leap in...
世界最先进的消费类闪存。加拿大TechInsights 通中？
Key takeaways from this discovery include:
- YMTC proved again the merits of the Xtacking Hybrid Bonding technology they developed for 3D NAND TLC and QLC applications. BSSC technology adopted for Xtacking3.0 232L realized yield and performance improvements, and cost reduction as well.
- YMTC is quietly developing advanced technology despite being hampered by issues following sanctions including limiting the company from supplying parts to Apple for China-based iPhones and being placed on the United States’ entity list.
- The recent memory downturn, as well as many memory manufacturers focused on cost saving measures, may have provided YMTC an opportunity to pull ahead with its higher bit density 3D Xtacking NAND.
- This discovery usurps Micron and Intel (Solidigm) who are also developing 232-layer QLC 3D NAND devices. It should be noted that Samsung is not developing QLC on its 236-layer (V8) 3D NAND because its current strategy is to focus on the V9 3D NAND TLC and QLC. However, at Samsung’s Memory Tech Day last week, the company announced the first QLC product targeting the mobile market, a 512GB UFS 3.1 product with 176-layers (V7) technology. SK Hynix is mostly focused on TLC devices rather than QLC products.
- Like the innovation revealed by TechInsights in the Huawei Mate 60 Pro’s HiSilicon Kirin 9000s processor (which used SMIC 7nm (N+2) process) evidence is mounting that China’s momentum to overcome trade restrictions and build its own domestic semiconductor supply chain is more successful than expected.
