加拿大TechInsights公司最新研究表明,中国闪存又突破了,在围堵的情况下又领先

sports_fan

新手上路
注册
2021-10-14
消息
455
荣誉分数
93
声望点数
38

The company’s new design follows the release of Xtacking4.0 devices, such as YMTC's 160-layer product, in the previous year. Industry experts had predicted that YMTC would incorporate this architecture into products with even higher layer counts. The new chip surpasses its predecessor, which featured 180 gates, and is most notable for its storage density, boasting an industry-first capacity of over 20 gigabits per square millimetre. TechInsights estimates the design contains approximately 270 active memory layers.

The new chip design’s architecture, which incorporates stacked active layers, significantly enhances storage density and performance. According to Choe, "YMTC is the leader in hybrid bonding technology, which is essential for higher-layered 3D NAND. That’s why Samsung and other NAND companies follow and prepare the hybrid bonding structure for the next generations."

韩国三星要抄作业了
 
旧新闻了。 中国在芯片上的突破在疫情前就已经启动了。
 
后退
顶部