最初由 cobra 发布
楼上的是行家呀。我不了解中国芯，我说的8M指的是8M gates, 现在0.13微米技术最多能做到38M gates，0.09微米可以达到70M gates吧，如果中国芯能做到8M gates很不错了。 (从process generation 划分是0.13微米 和0.09微米, 我把那个与Ldrawn 混在一起了，谢谢你更正)。
据我所知，从2002年底开始，CISCO等公司的新设计都是0.13了，几乎没新设计还用 0.18了。我原来也以为0.13比0.18 贵，最近得到更正，就是当DIE SIZE比较小时，0.13更便宜，所以听说nortel最近有计划将以前的0.25及 0.18的产品换成0.13的，正在等IBM 和TI报价呢。
据我所知现在已经有好几个芯片设计在用0.09微米了，而且不久会有更高一代技术出现。技术发展真的很快呀。
回国报效是谈不上的，一来力不从心，二来离开了技术环境，你就什么也做不了了，如你所说华为也是只能做做前端呀，主要是新技术新工艺对中国还不公开呀。
0.13u with 38M gates, that is too much. I am not saying that is impossible, I am just saying it is too hard. How big the chip going to be, I am not sure if there is any package can fit into it. And how much power it going to consume, must like a heater. 0.09u, there is too many unknow factors, when desing move toward deep sub-micron, a lot of things people do not know. Everyone is learning when they move forward.
Yeah, most Cisco designs are under 0.13u, but does not mean that is cheaper to them. The reason they have to go with 0.13u is that they require high speed IO, DDR RAM and other high speed macro support which is only available in 0.13 technology. The price to Cisco is definite not cheaper. Actually IBM or TI take the price advantage of the technology, they can make more money, not Cisco. But all those based on one assumption, high volume. The fact is that in the high-end ASIC cummunication area, the volume is really low, low volume means low profit, or even losing money.
At the begining of the project, everyone will claim high volume to bargain for the price. But after the project is done, you will find they only want 1000 parts per year. How many wafers for 1000 parts? probably just 3 wafers. That is why not many company would like to support high-end customers, like Cisco. Do u work for Cisco?
